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Item

Parameter
Base Material Thk. D.S. 0.2-3.8mm
MLB 0.4-3.8mm
Max. Board Size D.S. 700*1500mm
MLB 600*1500mm
Monthly Capacity Rigid PCB 15,000㎡(DS&Multi-Layer)
Hole Dia. Tolerance NPTH ±0.05mm
PTH ±0.076mm
Min. Hole Diameter 0.1mm(Laser hole), 0.15mm(Mechanical hole)
Min. Hole to Hole Tol. ±1mil
Min. trace/space 3mil/3mil
Solder Mask Hardness ≥6H
Surface Finish Immersion
Immersion gold/Immersion Silver/
Immersion tin/Lead-free HASL/Gold plating/OSP/HAL with Carbon
Outline Tolerance CNC Rout ±0.1mm
Punch ±0.13mm
V-cut Min. Board Thk. 0.4mm
E-test Voltage:10-300v;Insulation Resistance:1-20MΩ;
Peel off Strength 1.4N/mm
Thermal shock Resistance 260℃ 10sec 3times
Flammability Rate 94V-0
Warp and Twist ≤0.75%
Quality Standard GB4588.2;GB4588.4;IPC-600G, Class II/AQL-Ⅱ
Standard lead time
for prototypes
2 layers 2-4 work days
4 layers 6-8 work days
6-10layers 8-10 work days
12-20layers 10-14 work days
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